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sanken electric co., ltd. http://www.sanken-ele.co.jp/en/ LC5523F description the lc5500 series is the power ic for the led driver which has an incorporated power mosfet, designed for input capacitorless applications, and making it possible for systems to comply with the harmonics standard (iec61000- 3-2 class c). the controller adapts the average current control method for realizing high power factors, and the quasi-resonant topology contributes to high efficiency and low emi noise. the rich set of protection features helps to realize low com- ponent counts, and high performance-to-cost power supply. the LC5523F is intended for isolated designs. the incor- porated mosfet has a v dss (min) rating of 650 v and r ds(on) (max) of 1.9 . it is capable of a maximum output power of 60 w on 230 vac supply and 40 w on universal input supply (85 to 265vac) based on the thermal rating. note that the maximum output power can be up to 120% to 140% of this value. however, it may be limited in applica- tions with low output voltage or short duty cycle. single-stage power factor corrected off-line switching regulator ic typical application package: 7-pin to-220f not to scale lf 3052 lf 3054 lf 3051 features and benefits ? integrated on-time control circuit (it realizes high power factor by average current control) ? integrated startup circuit (no external startup circuit necessary) ? integrated soft-start circuit (reduces power stress during start-up on the incorporated power mosfet and output rectifier) ? integrated bias assist circuit (improves startup performance, suppresses vcc voltage droop during operation, and allows use of low-rated ceramic capacitor on vcc pin) ? integrated leading edge blanking (leb) circuit ? integrated maximum on-time limit circuit ? protection features: ? overcurrent protection (ocp): pulse-by-pulse ? overvoltage protection (ovp): pins vcc, ovp, and ocp, auto restart ? overload protection (olp): auto restart ? thermal shutdown (tsd): latched shutdown t1 c2 d1 d3 d2 d4 f1 l1 c1 d5 l2 d6 d9 d8 + - pc1 u2 dz1 q1 dz2 led pc2 c4 pc2 d7 r1 r8 r9 r10 r11 r12 r13 r14 r15 r16 r17 r18 r19 7 ovp r4 r5 r6 va c pc1 r7 c7 c8 c10 c11 c12 c13 c14 c15 c16 c9 c17 vcc 6 ocp fb c6 5 4 vcc 3 nc s/gnd 2 r20 1 d/st u1 c5 c3 r ocp r3 LC5523F control part dz3 r21 c18 november 26, 2012 applications ? led lighting fixtures ? led light bulbs LC5523F-ds
2 sanken electric co., ltd. LC5523F-ds single-stage power factor corrected off-line switching regulator ic LC5523F november 26, 2012 selection guide part number package LC5523F to-220f (specify leadform when ordering) absolute maximum ratings t a = 25c, unless otherwise specified characteristic symbol notes pins rating unit drain current 1 i dpeak single pulse 1 ? 2 9.2 a single pulse avalanche energy 2 e as i lpeak = 2.9 a, v dd = 99 v, l = 20 mh 1 ? 2 99 mj control part input voltage v cc 4 ? 2 35 v ocp pin voltage v ocp 5 ? 2 ? 2.0 to 5.0 v fb pin voltage v fb 6 ? 2 ? 0.3 to 7.0 v ovp pin voltage v ovp 7 ? 2 ? 0.3 to 5.0 v allowable power dissipation of mosfet 3 p d1 with infinite heatsink 1 ? 2 20.2 w without heatsink 1 ? 2 1.8 w internal frame temperature in operation t f D? 20 to 115 c operating ambient temperature t op D? 55 to 115 c storage temperature t stg D? 55 to 125 c channel temperature t ch D 150 c 1 refer to mosfet safe operating area curve. 2 refer to mosfet avalanche energy derating coefficient curve. 3 refer to mosfet temperature versus power dissipation curve. the polarity value for current specifies a sink as "+," and a source as ? ? ,? referencing the ic.
3 sanken electric co., ltd. LC5523F-ds single-stage power factor corrected off-line switching regulator ic LC5523F november 26, 2012 electrical characteristics of control part t a = 25c, v cc = 20 v, unless otherwise specified characteristic symbol test conditions pins min. typ. max. unit startup operation operation start voltage v cc(on) 4 ? 2 13.8 15.1 17.3 v operation stop voltage* v cc(off) 4 ? 2 8.4 9.4 10.7 v operating current i cc(on) 4 ? 2 ? ? 3.7 ma startup circuit operation voltage v startup 1 ? 2 42 57 72 v startup current i cc(startup) v cc = 13 v 4 ? 2 ? 5.5 ? 3.0 ? 1.0 ma startup current threshold biasing voltage-1* v cc(bias)1 4 ? 2 9.5 11.0 12.5 v startup current threshold biasing voltage-2 v cc(bias)2 4 ? 2 14.4 16.6 18.8 v normal operation pwm operation frequency f osc 1 ? 2 11.0 14.0 18.0 khz maximum on-time t on(max) 1 ? 2 30.0 40.0 50.0 s fb pin voltage minimum limit v fb(min) 6 ? 2 0.55 0.90 1.25 v maximum feedback current i fb(max) 6 ? 2 ? 40 ? 25 ? 10 a leading edge blanking time t on(leb) 5 ? 2 ? 500 ? ns quasi-resonant operation threshold voltage-1 v bd(th1) 5 ? 2 0.14 0.24 0.34 v quasi-resonant operation threshold voltage-2 v bd(th2) 5 ? 2 0.12 0.17 0.22 v protection operation ocp pin overcurrent protection (ocp) threshold voltage v ocp 5 ? 2 ? 0.66 ? 0.60 ? 0.54 v ocp pin source current i ocp 5 ? 2 ? 120 ? 40 ? 10 a ocp pin overvoltage protection (ovp) threshold voltage v bd(ovp) 5 ? 2 2.2 2.6 3.0 v overload protection (olp) threshold voltage-1 v fb(olp)1 6 ? 2 5.0 5.5 6.0 v overload protection (olp) threshold voltage-2 v fb(olp)2 6 ? 2 4.1 4.5 4.9 v ovp pin ovp threshold voltage v ovp(ovp) 7 ? 2 1.6 2.0 2.4 v vcc pin ovp threshold voltage v cc(ovp) 4 ? 2 28.5 31.5 34.0 v thermal shutdown activating temperature t j(tsd) ? 135 ? ? c *v cc(bias)1 > v cc(off) always.
4 sanken electric co., ltd. LC5523F-ds single-stage power factor corrected off-line switching regulator ic LC5523F november 26, 2012 electrical characteristics of mosfet t a = 25c, unless otherwise specified characteristic symbol test conditions pins min. typ. max. unit drain-to-source breakdown voltage v dss 1 ? 2 650 DD v drain leakage current i dss 1 ? 2 DD 300 a on resistance r ds(on) 1 ? 2 DD 1.9 switching time t f 1 ? 2 DD 400 ns thermal resistance r ch-f between channel and internal frame DDD 3.1 c/w
5 sanken electric co., ltd. LC5523F-ds single-stage power factor corrected off-line switching regulator ic LC5523F november 26, 2012 10 1 0.1 0.01 0.001 transient thermal resistance, r ch-c (c/w) transient thermal resistance curve time (s) 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 ambient temperature, t a (c) 30 25 20 15 10 5 0 with infinite heatsink 20.2 1.8 115 without heatsink 0255075 125 100 150 mosfet temperature versus power dissipation curve allowable power dissipation, p d1 (w) channel temperature, t ch (c) 100 80 60 40 20 0 25 50 75 125 100 150 eas temperature derating coefficient (%) mosfet avalanche energy derating coefficient curve drain-to-source voltage, v ds (v) 10 1 0.1 0.01 10 100 1000 mosfet safe operating area curve drain current limited by on-resistance 1 ms 0.1 ms drain current, i d (a) to use this graph, apply the s.o.a temperature derating coefficient taken from the graph at the left t a = 25c, single pulse channel temperature, t ch (c) 100 80 60 40 20 0 0 25 50 75 125 100 150 safe operating area temperature derating coefficient (%) s. o. a. temperature derating coefficient curve characteristic performance
6 sanken electric co., ltd. LC5523F-ds single-stage power factor corrected off-line switching regulator ic LC5523F november 26, 2012 functional block diagram functional block diagram functional block diagram pin-out diagrams (lf 3052) (lf 3051) (lf 3054) 2 3 4 6 1 5 7 d/st s/gnd nc vcc ocp fb ovp 1 2 3 4 5 6 7 d/st s/gnd nc vcc ocp fb ovp 2 4 6 1 3 5 7 d/st s/gnd nc vcc ocp fb ovp s/gnd q s r tsd leb d/st fb startup reg bias uvlo vcc ocp ovp ovp osc ocp detection bottom reg control feedback olp drv nc 3 control part LC5523F pin list table number name function 1 d/st mosfet drain pin and input of the startup current 2 s/gnd mosfet source and gnd pin for the control part 3 nc no connection 4 vcc supply voltage input and overvoltage protection (ovp) signal input 5 ocp overcurrent protection, quasi-resonant signal input pin, and overvoltage protection (ovp) signal input 6 fb feedback signal input and overload protection (olp) signal input 7 ovp overvoltage protection (ovp) signal input
7 sanken electric co., ltd. LC5523F-ds single-stage power factor corrected off-line switching regulator ic LC5523F november 26, 2012 package outline drawing, to-220f leadform 3051 b a lc 5.6 0.2 at base of pin at base of pin at tip of pin front view side view at tip of pin 0.3 5.850.15 5p1.170.15 50.5 0.2 1.1 0.2 7 6 5 4 3 2 1 10 15 0.5 10.4 7-0.55 +0.2 -0.1 7-0.62 0.15 2 0.15 2.8 +0.2 4.2 2.6 0.1 2.6 r-end 50.5 r-end -0.1 +0.2 0.45 2.540.6 5.080.6 0.5 0.5 0.5 0.5 gate burr unit: mm b: lot number 1 st letter: last digit of year 2 nd letter: month jan to september: numeric october: o november: n december: d 3 rd and 4 th letter: date 01 to 31: numeric 5 th letter: sanken control number package: to-220f-7l a: part # 5523f ?3.2 0.2 "gate burr" shows area where 0.3 mm (max) gate burr may be present pin treatment pb-free. device composition compliant with the rohs directive.
8 sanken electric co., ltd. LC5523F-ds single-stage power factor corrected off-line switching regulator ic LC5523F november 26, 2012 package outline drawing, to-220f leadform 3052 5.6 0.2 0.3 5.850.15 5p1.170.15 50.5 0.2 1.1 0.2 7 6 5 4 3 2 1 10 15 0.5 10.4 7-0.55 +0.2 -0.1 7-0.62 0.15 2 0.15 2.8 +0.2 4.2 2.6 0.1 2.6 r-end front view side view -0.1 +0.2 0.45 5.080.6 0.5 0.5 0.5 0.5 b a gate burr lc at base of pin at base of pin at tip of pin unit: mm a: part # 5523f b: lot number 1 st letter: last digit of year 2 nd letter: month jan to september: numeric october: o november: n december: d 3 rd and 4 th letter: date 01 to 31: numeric 5 th letter: sanken control number package: to-220f-7l ?3.2 0.2 "gate burr" shows area where 0.3 mm (max) gate burr may be present pin treatment pb-free. device composition compliant with the rohs directive.
9 sanken electric co., ltd. LC5523F-ds single-stage power factor corrected off-line switching regulator ic LC5523F november 26, 2012 package outline drawing, to-220f leadform 3054 0.5 0.5 0.5 0.5 7 6 5 4 3 2 1 7-0.62 7-0.55 0.2 10 (5.6) 0.2 2.8 0.3 15 0.15 2 b a gate burr -0.1 +0.2 0.5 3.8 3-( r1) 0.5 5 2.5 2.8 0.2 2.6 (1.1) 0.15 -0.1 +0.2 0.1 2.6 4.2 0.2 ?3.2 0.2 0.45 0.5 0.5 lc at base of pin 5p 1.17 0.15 = 5.85 0.15 plan view side view at base of pin at tip of pin at tip of pin unit: mm b: lot number 1 st letter: last digit of year 2 nd letter: month jan to september: numeric october: o november: n december: d 3 rd and 4 th letter: date 01 to 31: numeric 5 th letter: sanken control number package: to-220f-7l a: part # 5523f "gate burr" shows area where 0.3 mm (max) gate burr may be present pin treatment pb-free. device composition compliant with the rohs directive.
10 sanken electric co., ltd. LC5523F-ds single-stage power factor corrected off-line switching regulator ic LC5523F november 26, 2012 because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. cautions for storage ? ensure that storage conditions comply with the standard temperature (5c to 35c) and the standard relative humidity (around 40% to 75%); avoid storage locations that experience extreme changes in temperature or humidity. ? avoid locations where dust or harmful gases are present and avoid direct sunlight. ? reinspect for rust on leads and solderability of the products that have been stored for a long time. cautions for testing and handling when tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. ensure all test parameters are within the ratings specified by sanken for the products. remarks about using silicone grease with a heatsink ? when silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. if more silicone grease than required is applied, it may produce excess stress. ? volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink. our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: type suppliers g746 shin-etsu chemical co., ltd. yg6260 momentive performance materials inc. sc102 dow corning toray co., ltd. cautions for mounting to a heatsink ? when the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has an extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque. for mounting the products, the mounting surface flatness should be 0.05 mm or less. ? please select suitable screws for the product shape. do not use a flat-head machine screw because of the stress to the products. self-tapping screws are not recommended. when using self-tapping screws, the screw may enter the hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. that may stress the products and may cause failures. ? recommended screw torque: 0.588 to 0.785 n m (6 to 8 kgf cm). ? for tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal stress fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure. tightening with an air driver makes a substantial impact. in addition, a screw torque higher than the set torque can be applied and the package may be damaged. therefore, an electric driver is recommended. when the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten with the specified torque. when using a power driver, torque control is mandatory. soldering ? when soldering the products, please be sure to minimize the working time, within the following limits: 2605c 101 s (flow, 2 times) 38010c 3.50.5 s (soldering iron, 1 time) ? soldering should be at a distance of at least 2.0 mm from the body of the products. electrostatic discharge ? when handling the products, the operator must be grounded. grounded wrist straps worn should have at least 1 m of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. ? workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. ? when using measuring equipment such as a curve tracer, the equipment should be grounded. ? when soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. ? the products should always be stored and transported in sanken shipping containers or conductive containers, or be wrapped in aluminum foil.
11 sanken electric co., ltd. LC5523F-ds single-stage power factor corrected off-line switching regulator ic LC5523F november 26, 2012 ? the contents in this document are subject to changes, for improvement and other purposes, without notice. make sure that this is the latest revision of the document before use. ? application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod- ucts herein and sanken can assume no responsibility for any infringement of industrial property rights, intellectual property r ights or any other rights of sanken or any third party which may result from its use. ? although sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of se micon- ductor products at a certain rate is inevitable. users of sanken products are requested to take, at their own risk, preventativ e measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. ? sanken products listed in this document are designed and intended for the use as components in general purpose electronic equ ip- ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). when considering the use of sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales representative to discuss, prior to the use of the products herein. the use of sanken products without the written consent of sanken in the applications where extremely high reliability is requi red (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. ? in the case that you use sanken products or design your products by using sanken products, the reliability largely depends on the degree of derating to be made to the rated values. derating may be interpreted as a case that an operation range is set by dera ting the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. in general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stres ses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. for these stress es, instantaneous values, maximum values and minimum values must be taken into consideration. in addition, it should be noted that since power devices or ic's including power devices have large self-heating value, the de gree of derating of junction temperature affects the reliability significantly. ? when using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, ch emically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ? anti radioactive ray design is not considered for the products listed herein. ? sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of sanken's dis tribu- tion network. ? the contents in this document must not be transcribed or copied without sanken's written consent.

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